40 years of ALD accumulation has helped surpass Moore, and SIRUI has completed the first phase of development layout

Deposition, photolithography, etching, and plasma implantation are the four key technologies in the manufacturing process of semiconductors and beyond Moore. In the investment and construction of the new wafer production line, about 80% of the investment is used to purchase equipment, and thin film deposition equipment accounts for about 25% of it. The mainstream thin film deposition processes in the industry mainly include atomic layer deposition (ALD), physical vacuum coating (PVD) and chemical vacuum coating (CVD).

Deposition, photolithography, etching, and plasma implantation are the four key technologies in the manufacturing process of semiconductors and beyond Moore. In the investment and construction of the new wafer production line, about 80% of the investment is used to purchase equipment, and thin film deposition equipment accounts for about 25% of it. The mainstream thin film deposition processes in the industry mainly include atomic layer deposition (ALD), physical vacuum coating (PVD) and chemical vacuum coating (CVD). Among them, ALD is a kind of CVD, which is the most advanced thin film deposition technology at the moment. A related report from the research organization GIR shows that the global Atomic Layer Deposition (ALD) equipment market is expected to grow at a compound annual growth rate of 25.1% from 2021 to 2026, which will increase from US$1.066.1 billion in 2019 to US$2.6129 billion in 2026.

40 years of ALD accumulation has helped surpass Moore, and SIRUI has completed the first phase of development layout
Figure 1: The proportion of investment in Semiconductor equipment

With 40 years of ALD accumulation and blessing, SIRUI has joined hands with the national innovation center to accelerate the industrial layout

“Focus on ALD innovation and help surpass Moore”, in May 2021, ALD equipment and service provider-Qingdao Sifang Sirui Intelligent Technology Co., Ltd. (hereinafter referred to as Sirui Intelligence or SRII) and the National Intelligent sensor Innovation Center (hereinafter referred to as China The strategic cooperation signing ceremony of the Innovation Center (NISIC) was officially launched in Shanghai. Mr. Nie Xiang, the general manager of SIRUI, and Dr. Jiao Jiwei, the vice president of the National Innovation Center, attended the signing ceremony. Participants from both directions said that this strategic cooperation will be oriented to the field of Beyond Moore, and based on atomic layer deposition (ALD) technology to carry out joint research and development in important fields such as MEMS and CMOS image sensors, and work together in-depth to accelerate the industrial landing in the field of Beyond Moore. And technological innovation.

40 years of ALD accumulation has helped surpass Moore, and SIRUI has completed the first phase of development layout
Picture 2: Mr. Nie Xiang (left) and Dr. Jiao Jiwei formally signed a strategic cooperation on behalf of the two parties

Mr. Nie Xiang said: “The Yangtze River Delta represented by Shanghai is the highland of China’s semiconductor industry, and the National Innovation Center is also the leading organization in China’s surpassing Moore field. Leveraging on the nearly 40 years of ALD technology research and development by BENEQ, a subsidiary of SIRUI Experience and world-class ALD equipment and solutions, the two parties will cooperate in depth to jointly establish a technology center and an industrialization center beyond the Moore field, provide comprehensive and systematic technical solutions for the industry with an open and inclusive mechanism, and work together to advance the Moore field. The industrialization and innovative development of the country.” Among them, SIRUI’s 8” ALD equipment has been successfully equipped on the Beyond Moore R&D pilot line of the National Innovation Center, meeting the development needs of the country’s strategic emerging industries.

Dr. Jiao Jiwei said: “The strategic cooperation between National Innovation Center and SIRUI will use ALD equipment and technology as the starting point and fulcrum. In the future, the localization of manufacturing equipment will include new semiconductor materials, new MEMS processes, as well as ALD artificial intelligence and the Internet. Explore new applications and other directions. This signing ceremony marks a new level of cooperation between the two parties. We look forward to the two parties and more industry partners working together on the track beyond Moore for common development.”

ALD technology becomes the “first choice”, BENEQ TransformTM Break through the boundaries of productivity and efficiency and new heights in performance

In fact, with the application and development of new materials, new processes, and new processes in the emerging semiconductor manufacturing industry, ALD technology can make materials deposited on the surface of the substrate in the form of a monoatomic film (0.1nm), and control the thickness of the deposited layer. , 3D special-shaped materials have significant advantages in surface uniformity, no pinholes on the surface, and refractive index. Therefore, they are especially suitable for the manufacture and production of MEMS, CMOS image sensors and other products, and have gradually become the first choice for coating deposition technology beyond the Moore field.

40 years of ALD accumulation has helped surpass Moore, and SIRUI has completed the first phase of development layout
Figure 3: Patrick Rabinzohn, head of semiconductor business of BENEQ, a subsidiary of SIRUI Intelligence, explained the application case of ALD in the field of Beyond Moore through remote connection

In this regard, a wholly-owned subsidiary of Sirui Intelligence-BENEQ’s new TransformTM The series equipment is a competitive ALD solution specially designed for the market beyond Moore. TransformTM The platform adopts a new cluster design and cutting-edge coating deposition technology, which can deposit a variety of materials on the surface of 8” and below wafers, including Al2O3, SiO2, AlN, TiN and other oxides and nitrides, and achieve fully conformal and highly uniform film deposition.

40 years of ALD accumulation has helped surpass Moore, and SIRUI has completed the first phase of development layout
Figure 4: Transform representing the industry’s top general-purpose ALD technologyTM Series equipment

Patrick Rabinzohn, head of BENEQ’s semiconductor business, said: “TransformTM The platform is compatible with functions such as monolithic, batch, thermal and plasma, and is currently the only general advanced platform in the industry that integrates multiple functions. Not only that, TransformTM The platform has the advantage of flexible configuration. Customers can choose ‘3 groups of ALD modules + pre-heating modules’ to build Transform according to their own needs.TMStandard configuration, or ‘2 groups of ALD modules + pre-heating module’ to build TransformTM The simplified configuration of Lite realizes differentiated and more efficient production and management methods, and opens up intentional orders among mainstream manufacturers. “

Take 50 nanometer aluminum oxide as an example, if the standard configuration of Transform is usedTMThe maximum output of the system can reach more than 40 wafers per hour, and even the Lite equipment can reach more than 25 wafers per hour. This is a disruptive technological breakthrough in the traditional perception of ALD in the entire industry!

According to Patrick, BENEQ TransformTM The platform has passed SEMI S2/S8 certification, supports SECS/GEM standards, and is gradually moving towards mature deposition technology for 12″ wafers, which will provide customers with flexible, reliable, and high-capacity semiconductor wafer coating mass production solutions.

Broaden the market application matrix and empower a wide range of industry innovations with universal ALD technology

In addition to vertical breakthroughs in technology, performance, and production capacity, with BENEQ’s advanced general-purpose ALD technology, SIRUI Intelligence is expanding application innovations in more cutting-edge vertical industries.

In another speech by remotely connecting with Finnish experts, Alexander Perros, BENEQ’s semiconductor business technical director, said: “BENEQ’s general-purpose ALD technology has a rich application matrix of Beyond Moore, including power devices, filters, MEMS and CIS. At the same time, BENEQ has launched different ALD solutions for different market segments, mainly including high-K dielectric, surface passivation, ALD nucleation layer, chemical barrier layer, moisture barrier and anti-reflective film, etc. “For example, surface passivation Different ALD materials can be used to achieve surface passivation, and the moisture barrier plays a key role in packaging; these have strong versatility in a wide range of applications.

40 years of ALD accumulation has helped surpass Moore, and SIRUI has completed the first phase of development layout
Figure 5: An example of the application field matrix of BENEQ universal ALD technology

In summary, ALD is one of the advanced technologies required for traditional semiconductor manufacturing, and it is also a key technology for the development of emerging semiconductors, pan-semiconductors and non-semiconductor industries represented by optical coatings. SIRUI Intelligence is committed to becoming a world-class ALD equipment and service provider by providing cutting-edge, innovative and flexible ALD equipment and service solutions.

The Links:   6MBI20F-060 CMF1N1721-A1-E

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