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Focusing on chip design, Huinengtai completed the A+ round of financing of 50 million yuan

News from the investment community on April 25, recently, Shenzhen Huinengtai semiconductor Technology Co., Ltd. (hereinafter referred to as: Huinengtai) announced the completion of 50 million yuan A+ round of financing, from Jiaxing Waniu Zhixin Equity Investment Partnership, GF Qianhe Investment Co., Ltd., Shenzhen Weihe Ruiyuan Investment Partnership, Guangdong Yunsheng Equity Investment Partnership and other joint investments, and the old shareholder Shenzhen High-tech Investment continued to add. This round of financing is mainly used for the accelerated layout and market promotion of new products.

Huinengtai was established in 2015, focusing on the definition, development and commercialization of high-performance analog and mixed-signal integrated circuits. The company team has more than ten years of development experience in the field of industrial-grade power chips. The company is currently committed to building an overall solution for the USB Type-C and PD ecological chain, and has developed more than ten high-performance USB eMarker chips, PD charging end protocol chips, PD power receiving end protocol chips, load switch chips and other products. Achieve mass production and are widely used in charging adapters, high-quality cables and various mobile devices. At the same time, actively deploy various power management chips and USB signal transmission chips. While continuing to provide customers with cost-effective products, and gradually establish a strict quality management system, the company will continue to deepen long-term strategic cooperation with leading customers in the industry.

The company’s current main products include fast charging protocol chips and digital power management chips. In terms of the fast charging protocol chip business, 9 products have been released, and there are more than 300 client cooperation projects. Benchmark customers include Lenovo, Belkin, Verizon, Walmart, Hikvision, etc., which have become the fastest charging protocol chips in the field of shipments. One of the three largest domestic chip design companies.

It is reported that Huinengtai received a joint angel round of financing from Zhengxuan Investment and Shenzhen High-tech Investment in 2019; it received a joint A round of investment from Xiamen Semiconductor and Falcon Investment in 2020, and the old shareholders Zhengxuan Investment and Shenzhen High-tech Investment added.

Author: wendyhe Source: investment community

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SaaS company UMU announced the completion of hundreds of millions of C3 rounds of financing, led by Huaxing

On November 1, UMU, an educational SaaS company, announced the completion of its C3 round of financing of hundreds of millions of yuan. This round of financing was led by Huaxing New Economy Fund, followed by Wuyuan Capital. Huaxing Capital served as the exclusive financial advisor for this financing.

Prior to this, UMU has completed 6 rounds of financing, including Gaocheng Capital, Hillhouse Ventures, Wuyuan Capital, Huaxing New Economy Fund, etc.

This round of financing will be used for learning science and AI technology, as well as for talent development, business development, and organizational development of enterprises, so that enterprise learning can truly bring about changes in behavior and performance, and enhance the core competitiveness of enterprises.

Regarding this round of financing, Bao Fan, chairman of China Renaissance, founding partner of the fund, and chief investment officer, said that a large number of contemporary enterprises have transformed from human-driven to knowledge-driven, and how to manage knowledge, build a knowledge system, and realize human capital appreciation , has become one of the most important issues for enterprises. In this area, we are delighted to see that UMU has made corporate training offerings for the global digital native generation.

According to Qichacha, the UMU interactive learning platform was established in 2014. It is an online interactive education and training platform. In November 2019, it received investment from angel investor Wang Gang. The investment amount has not been announced.

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After being blocked by the United States, why does SMIC still make more money?

At the end of December 2020, SMIC, the Chinese chip foundry giant and the hope of the whole village in China’s chip industry, was hit hard by the United States and was added to Huawei’s “same model” entity list.

Since the high-end chip manufacturing equipment used by SMIC is provided by Western companies such as Europe, America and Japan, the blacklisting this time has a profound impact on SMIC. Generally speaking, the companies on the list are not completely cut off from supply, but confirm which technologies and items can be imported and which cannot be imported under the review of the US side. But for SMIC, when it was added to the list this time, the United States directly added a clause: For chip manufacturing equipment with the most advanced technology below 10nm, the United States directly refused to approve it and did not allow it to be imported.

And we must know that the current 1,2,000 mobile phones have also begun to use 7nm process chips. Therefore, this blackout basically makes SMIC blocked the possibility of further expanding its business in the field of high-end chip manufacturing in the future.

In this context, last week, SMIC released its first quarterly financial report after being blocked. Although SMIC’s stock price has come out of an avalanche of decline since it was added to the list, as if it will go bankrupt tomorrow, in fact, judging from the financial report, people are actually doing well.

In the first quarter, SMIC’s revenue was 7.29 billion yuan, a year-on-year increase of 13.9%; net profit was 1.032 billion yuan, a year-on-year increase of 136.4%; gross profit margin was 26.97%, compared with 21.46% in the previous quarter. It increased by 5 points in a single quarter.

To sum up, it means that SMIC’s revenue has increased slightly, its profits have soared, and its earning ability has been greatly improved.

However, from the perspective of revenue sources, on the one hand, in the context of global mobile phone shipments hitting a new high since 2015 (global smartphone shipments reached 340 million units in the quarter, an increase of 24% year-on-year), SMIC is a smartphone chip maker. The proportion of revenue brought by foundry has dropped significantly. On the other hand, SMIC’s highest-end process chips only stop at 14nm, and the proportion of revenue brought by 14nm process chips has also shown a downward trend.

Compared with TSMC, the global chip foundry leader, its latest financial report shows that the company’s revenue from 5nm process chip manufacturing has exceeded 20% in the two quarters, and half of its revenue is brought by 5nm and 7nm process chips.

In addition, more than half of TSMC’s revenue is from the mobile phone chip business, and more than 30% is brought by the manufacture of computer and server chips for world-renowned CPU or GPU giants such as AMD and Nvidia.

Therefore, TSMC’s business is getting more and more high-end, and it can even be said that large companies that do high-end chips will find TSMC. For example, major mobile phone chip manufacturers such as Apple, Qualcomm, and MediaTek all manufacture 5G chips by TSMC. Before Huawei was cut off from supply, all HiSilicon high-end chips could only be manufactured by TSMC.

Therefore, there is a technical gap between SMIC and TSMC, which is widening under the shadow of supply interruption.

So why is SMIC still making money?

This is because, from 2020 to the present, the global chip has been lacking crazy (why can read the chip lack such a ghost). Simply put, the demand for chips in all walks of life has exploded. Today, when the chip industry is highly divided, except for a few major chip manufacturers with their own chip manufacturing lines, such as Intel and Samsung, neither Apple, Qualcomm nor Nvidia have any chip manufacturing capabilities. The chip company is only doing the design of the chip, and finally the chip must be manufactured by a few chip foundries in the world.

Even masks, protective gloves and other anti-epidemic supplies suffered from severe shortage of production capacity during the epidemic, not to mention the high-end “jewel in the crown” level of high-end chips with complex production processes, highly specialized production processes, limited global supply of production equipment, and scarce engineers. In the manufacturing industry, when the demand increases, the production line expands slowly and cannot increase production in the short term.

For the majority of small and medium chip companies, it is even more impossible to build their own chip production lines. Therefore, no matter what process or level of chip orders, they must snatch the limited chip manufacturing capacity.

Demand exceeds supply, which naturally leads to price increases.

More importantly, although there is no advanced process (5nm, 7nm, 10nm such high-end chip process) revenue in SMIC’s business composition, in fact, the mature process of more than tens of nanometers in the global chip market share still accounts for the vast majority. most.

Then some students may have to ask. Now, when I look at the news about chips, they are all commercial 5nm, impacting 3nm, even IBM has come up with 2nm, TSMC has started to develop 1nm, why are dozens of nm antiques from several generations ago Is there such a big market for chips?

This is because, except for a very small number of chips used in mobile phones, computers, and servers, which require high-end manufacturing processes, the chips required for almost all Electronic components at present do not have such high process requirements.

For example, the most in short supply of automotive-grade chips used in automobiles, mainstream products of 28nm are considered high-end, while RF chips, memory chips, IoT chips and other seemingly high-end components actually do not have such high process requirements.

Therefore, when the big mobile phone chip manufacturers and computer chip manufacturers are fighting the bayonet in the “high-end player zone” of the chip manufacturing process, the vast majority of technology companies are still quietly using tens of nanometers or even microns. chip. This is the real broad market for the chip industry.

Although SMIC has no ability to sit on the table of the masters, it occupies a place in the public mahjong room.

In other words, SMIC’s production line can produce almost all chip products except for a few high-end chip products. At present, the most short-circuit chip companies are not the advanced process chip companies with deep pockets and the ability to seize TSMC’s production capacity, but the mature process chip companies that have to queue up a little later. Therefore, in the eyes of the Chinese people, SMIC, which is “incompetent in technology”, is actually a genuine sweet pastry in the chip industry. On the one hand, the production line is running at full capacity, and on the other hand, the OEM price is rising, which makes SMIC. International made a lot of money.

Even companies at the level of Qualcomm and Broadcom have many types of chips handed over to SMIC for foundry. Even in 2020, when they are blocked, their US customer revenue will account for a quarter.

Zhao Haijun, CEO of SMIC, even released the following words: “The company’s production capacity allocation principle is to give priority to satisfying customers who have long-term cooperation and common development with SMIC, and secondly to consider high-margin products, while maintaining close relationships with other customers. Communicate and negotiate to ensure the most important needs.” You can say whether you are crazy or not.

However, compared with other chip foundries, still being listed on the entity list is the biggest hidden danger of SMIC. When TSMC and UMC began to put aside their sleeves to introduce equipment and build production lines to expand production capacity, although SMIC had money, it really had nowhere to spend. If they wanted to expand production capacity, almost all the equipment and technologies they wanted to buy had to be approved by Americans. agree.

Gao Yonggang, Chief Financial Officer of SMIC, commented: “The entire market is developing positively this year. Under normal circumstances, the company should have continued its rapid growth last year. However, the company has been included in the entity list by the US government and is purchasing US-related products and technologies. The company is still facing uncertain risks in the second half of this year.”

Therefore, in the face of the golden age of explosive chip demand and making money, although SMIC, which is “surviving in the cracks”, can still continue to make money, the money is indeed not solid and unpleasant.

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BittWare and Achronix Announce Strategic Collaboration and Launch of Enterprise-Class PCIe Accelerator Card Products Using 7nm Speedster7t FPGAs

SINGAPORE – November 18, 2019 – BittWare, a Molex company, a leading supplier of enterprise-class FPGA accelerator cards for a variety of demanding computing, networking and storage applications, announced that it has partnered with Achronix semiconductor, Inc. A strategic partnership is in place to launch the S7t-VG6 PCIe accelerator card product – a feature-rich PCIe card supporting the new Achronix 7nm Speedster7t FPGA. This next-generation product offers a series of breakthrough features, including low-cost and highly flexible GDDR6 memory, which can provide HBM-class memory bandwidth, as well as high-performance machine learning processors and revolutionary 2D network-on-chip, The result is extremely high bandwidth and energy efficient data movement.

“BittWare has successfully developed and deployed advanced processing technologies for high-demand applications for three decades,” said BittWare President Jeff Milrod. “Achronix is ​​introducing a variety of novel approaches, architectures and implementations to the FPGA market, with the S7t card We’re excited to take advantage of these with the launch of the 2019-09-20. We’ll be able to deliver leading memory bandwidth and high-speed storage, network, and host interfaces while reaching new levels of price/performance and energy efficiency. Putting the Speedster7t on the I’m confident that the innovations of Alpha, combined with BittWare’s extensive experience and deep knowledge of accelerator card IP, will provide a compelling platform for data center, cloud infrastructure and enterprise solutions.”

Achronix CEO Robert Blake said: “We are very excited to be collaborating with BittWare and the wider Molex Group to announce the new VectorPath S7t accelerator card. The market response to Achronix’s new Speedster7t FPGA product family has been overwhelmingly positive. In order to provide our customers with the ability to quickly evaluate Speedster7t devices at the card level and server level and move to mass production, we needed a partner with in-depth design experience and the necessary logistics capabilities to serve our growing global customers Group support. As the market leader in FPGA-based PCIe cards and servers, BittWare was certainly the clear choice.”


Features of VectorPath S7t-VG6 Accelerator Card

BittWare’s VectorPath accelerator cards are designed for high-performance, high-bandwidth data applications with the following hardware features:

1 x 400GbE and 2 x 100GbE ports

8 banks of GDDR6 memory with aggregate bandwidth up to 4 Tbps

20 Tbps 2D Network on Chip (NoC)

1 bank of DDR4 with ECC running at 2666MHz

·Compliant with PCIe specifications and certification requirements

692K of 6 input LUTs

This enterprise-class product leverages BittWare’s extensive experience in accelerator card design, certification, deployment and support. Market-leading features include:

Thermal cooling options: passive, active or liquid

Integrated Board Management Controller (BMC)

· Supports Linux and Windows operating systems

Developer Kit: API, PCIe driver, application example design and self-troubleshooting

· Option to source the S7t as a pre-integrated Dell or HP Enterprise server from BittWare’s TeraBox family:

Shipments of the first S7t-VG6s are scheduled to begin in early Q2 2020. Please visit http://www.BittWare.rcom/S7t-VG6 to download the detailed data sheet.

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Henkel offers resins for BCN3D’s novel production-grade 3D printer

VLM allows objects to be printed from resins far thicker than can be used with vat-based printers, with the higher viscosity allowing chemistry which produces tougher end-products.

Little has been disclosed about the resulting materials. Elastomeric end products is said to be one market the companies are aiming at.

“These materials can include a high fraction of oligomers to obtain a loosely cross-linked polymer network: a structure that can flexibly withstand mechanical stresses, acting like industrial-grade moulded elastomers,” said BCN3D.

Saint Gobain and Prodrive are other partner companies.

BCN3D and Henkel will be showing parts made by VLM 3D printing at the Rapid exhibition in Detroit (17 – 19 May).

Henkel is the company behind Loctite brand materials.

SI: Automotive semiconductor shortage will continue until 2023

According to the 2021 automotive Semiconductor market statistics released by the research institute Semiconductor Information (SI), Infineon ranked first in the market with sales of $5.725 billion in automotive semiconductors, and automotive semiconductor sales accounted for about 44% of the company’s revenue in the same period.

NXP Automotive Semiconductors, which has the second largest market share, has a revenue of US$5.493 billion, and Renesas, which ranks third, has a revenue of US$4.21 billion.

The top ten manufacturers have a combined revenue of about US$69 billion, accounting for 46% of the overall market.

Bill Jewell, president of SI, believes that it will take time to alleviate the shortage of automotive semiconductors, and the supply chain tension will continue until 2023. Vehicle prices are expected to continue to rise due to limited vehicle production capacity.

Not only the competition between China, the United States and Europe, but also India to join the 5G competition?

Reliance Industries chairman Mukesh Ambani outlined his bold vision for the mobile sector, announcing that engineers at Jio Platforms have designed and built from the ground up, Mobile World Live reports. A complete 5G system has been developed and is ready for testing as soon as spectrum becomes available, with field deployment expected in 2021.

The importance of 5G technology can no longer be mentioned. Not only is China, the United States and Europe competing, but India is now joining in. Reliance Industries, owned by India’s richest man Mukesh Ambani, recently announced that it has developed its own 5G equipment, claiming to be 100% local technology, which can not only meet the needs of India, but also plans to export to other countries in the future.

Mukesh Ambani is chairman of Reliance Industries, one of India’s largest groups with telecommunications as its core business. Mukesh Ambani announced that its Jio platform engineers have designed and developed a complete 5G system from scratch, which can be tested once spectrum is available, with field deployment expected in 2021.

Ambani hinted that Reliance’s work could go beyond infrastructure, recounting that a just-forged partnership with Google to develop an affordable 4G smartphone would take it a step further: “We believe we can design cost Only a fraction of the current entry-level 4G and even 5G smartphones.”

Offering affordable smartphones will help overcome a key hurdle preventing today’s feature phone users from upgrading, he explained.

“India is on the doorstep of 5G, and we should accelerate the migration of 350 million Indians who are currently using 2G feature phones instead of affordable smartphones.”

The partnership with Google forms part of the search giant’s 337 billion rupiah ($4.5 billion) investment to acquire a 7.73 percent stake in Jio Platforms. It is the latest in a series of investments in the Jio platform by non-domestic companies, which Ambani noted will help the company develop new products for India.

Together with Google’s investment, strategic and financial investors have pledged a total of Rs 1.52 trillion over the past few months in exchange for a 32.97% stake in Jio Platforms. Reliance Jio had 388 million mobile users as of the end of March, and aims to have more than 500 million mobile users and deploy more than 1 billion smart sensors within the next three years.

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TE launches NanoRF optical modules for military applications

Targeting the defense industry’s VPX-based embedded computing systems that require increased bandwidth and radio frequency (RF) signaling, TE Connectivity has launched its line of NanoRF optical hybrid modules. These hybrid modules feature high-density RF and optical connections for common connector module applications in military applications such as radar, electronic warfare (EW) missile guidance and tactical communications.

They can be used in any small footprint applications where high-frequency RF and optical signals are critical, said TE.

Click for a larger image. (Source: TE Connectivity)

The NanoRF optical hybrid modules support cable mechanical transfer (MT) and edge-mount transceivers, which provides additional modularity and options. In addition, intermateability and interoperability among VPX hardware suppliers is achieved thanks to multiple slot profiles and connector modules added to the VITA 65.0 and VITA 65.1 compliant backplanes and board-level profiles. The NanoRF optical hybrid modules are being defined in the VITA 66.5 draft standard, which is expected to be released in 2022.

A key design feature of the hybrid modules is a floating insert on the backplane side that contains both NanoRF contacts and optical MTs. This allows precise alignment of the RF contacts and MTs before engagement. This is said to enable the highest density in a VPX slot and reduce the potential for damage.

The connector modules provide a rated frequency of 85 GHz and a 50-ohm impedance. They are rated for 500 mating cycles and offer a mechanical temperature range of -55°C to 125°C. They are available in base-card and mezzanine edge mount or cable options.

about TE Connectivity