Dense ICs are almost exclusively assembled with SMT components and soldered in a reflow oven.
However, it is sometimes necessary to include THT components on the circuit board. This has a decisive disadvantage: THT components need to be soldered differently, a second soldering process is necessary.
THR components, through-hole components, are specially designed for automated assembly and high thermal stress in the reflow oven.
During the assembly process, a paste is first printed into the vias for the THT pins, and then the component is pushed through the solder paste. As the paste melts in the reflow oven, the liquid solder retracts into the vias due to wetting and capillary forces and forms the solder joint.
The open fuse holder OGN is designed for 5×20 fuses of various types. It naturally complies with the tightened rules of glow wire resistance according to IEC 60335-1. If desired, it can be converted into a closed fuse holder by means of an optionally available cover.
In the near future Schurter will offer the OGN for THR pre-assembled with a 5×20 fuse in blister packaging (tape & reel). This according to customer requirements for fully automated PCB assembly. Just as SCHURTER is already doing with the OGN for SMT today.